'SAMs meet MEMS': surface modification with self-assembled monolayers for the dry-demolding of photoplastic MEMS/NEMS

摘要

In this contribution we demonstrate the use of self-assembled monolayers (SAMs) as anti-adhesion coating to assist the removal of photoplastic MEMS/NEMS with a patterned metal layer from the surface without wet chemical sacrificial layer etching, so-called 'dry-demolding'. The SAMs functionality here is to reduce the stiction between the surface and a thin evaporated metal film. The double-layer SAM/metal provides enough stability to support subsequent micromachining steps